The annual ISTA Forum event is from May 1st – 3rd in Houston, Texas, and TempAid will be on-site and would like to meet you in person. If you plan to attend the event this year. Please drop by the TempAid booth (Booth number 27) to discover our vast range of products and solutions specifically designed to help you maintain the temperature consistency of your shipments.
One of the event’s highlights will be the debut of our groundbreaking PCM Envelope Mailer. This newly validated solution incorporates PCM refrigerants to maintain stable temperatures and guard against fluctuations. With fewer components and storage space required, this solution reduces shipping and component costs by up to 40%, representing a major step forward in temperature control technology.
Our knowledgeable professionals will also be available to address any inquiries and offer customized consultations. To optimize your experience at the event, you can arrange a meeting with us beforehand or register here.
The ISTA annual forum provides a platform for the packaging community to address current challenges, examine the most effective practices in the industry, explore emerging trends, and contribute to future transport packaging development.